Loctite HY 4070 Universal Repair Hybrid Adhesive

• Loctite HY 4070 Universal Bonder is designed for the assembly of parts with bond gaps up to 0.2 in (5 mm), and/or for applications where the complete cure of excess adhesive is a must.
• The gel consistency prevents adhesive flow even on vertical surfaces. HY 4070 is ideally suited for applications where temperature and moisture resistance is required.
• Best application results are achieved with use of the LOCTITE cyanoacrylate mixing nozzle (contained in the 11 gram kit).
• Fast fixturing.
• Moisture resistant.
• Temperature resistance from -40 to +100°C.
• Gap filling up to 5mm.
• Gel consistency prevents adhesive flow, even on vertical surfaces.
• Excellent bonding characteristics to a variety of substrates including plastics, rubbers, and metals.